XGSP40 SOLDER PASTE 40g
AED 72.66
In stock
SKU
TPSA0215
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Specifications:
Material: plastic solder paste
Size: approx. 37 * 22 mm
Model: XGSP40
Alloy: Sn63 / Pb37
Micron: 20-38um
Melting point: 183 degrees Celsius
Applications: Mobile phone repair, computer and digital services industries, high precision circuit board SMT soldering, BGA soldering processes, etc.
| Brand Product | Besomi |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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Stock |
Shipping Method |
ETA |
Cost |
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Available |
Self Pickup |
1 Day |
Free |
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Available |
inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
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Available |
International |
4 - 7 Days |
180 AED / 49 $ |
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pre-order |
General |
2 Weeks |