The bottom board of the BGA adapter is designed for S71WS256PC0HF3TL flash memory devices in a matrix configuration of 10x8 balls. It features sockets for 4x25 wire wrap pins for connection to the BGA-Top-X, allowing for easy and secure attachment. The bottom configuration consists of 2 rows with 2x24 pins in a square pattern, with a pin pitch of 0.6x0.6mm and row spacing of 600mil, ensuring precise and reliable connections. The BGA adapter is made in Slovakia and comes with an order number of 70-0812, guaranteeing quality and performance.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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Stock |
Shipping Method |
ETA |
Cost |
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Available |
Self Pickup |
1 Day |
Free |
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Available |
inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
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Available |
International |
4 - 7 Days |
180 AED / 49 $ |
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pre-order |
General |
2 Weeks |