The bottom board of the BGA adapter with Ord. no. 70-1034 is specifically designed for NAND flash MCP (Multi-Chip Package) devices in a matrix 13x13 configuration. It is made in Slovakia and is compatible with BGA-Top-X board using 8x25 3x20 sockets for wire wrap pin connections.
The bottom board features a 2x24 pin configuration, with square pins measuring 0.6x0.6mm in size and a row spacing of 600 mil. This configuration is designed to provide a reliable and secure connection to the corresponding NAND flash MCP devices in a 13x13 matrix.
Please note that it's important to refer to the manufacturer's documentation or contact the manufacturer directly for specific details on the compatibility of the adapter with the intended NAND flash MCP devices, including pinout, pin spacing, and electrical compatibility. This will ensure that you have accurate and up-to-date information for your specific needs and to ensure proper usage of the adapter with the intended devices.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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