The bottom board of the BGA adapter with order number 70-0777 is designed for use with ST M58LW032D memory devices in a BGA (Ball Grid Array) package, in a matrix arrangement of 8x8. It is made in Slovakia to high-quality standards, ensuring reliable performance.
The bottom board features 2 rows of 24 pins, arranged in a square pattern with a pin pitch of 0.6x0.6mm and rows spacing of 600mil. These pins provide the necessary connections for interfacing with the ST M58LW032D memory devices, enabling data transfer and programming operations.
The connection to the BGA-Top-X is facilitated through 4x25 sockets for wire wrap pins, providing a reliable and convenient interface for programming and interfacing operations with the memory devices.
The order number for this bottom board of the BGA adapter is 70-0777, and it is designed specifically for use with ST M58LW032D memory devices in a BGA package with a matrix arrangement of 8x8. It is made in Slovakia and provides reliable and convenient programming and interfacing capabilities for these memory devices.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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Available |
Self Pickup |
1 Day |
Free |
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inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
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International |
4 - 7 Days |
180 AED / 49 $ |
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pre-order |
General |
2 Weeks |