The bottom board of the BGA adapter with order number 70-0761 is designed for use with Atmel I2C Serial EEPROM AT24Cxxx devices in a BGA package arranged in a 4x2 matrix. This bottom board is made in Slovakia, ensuring high-quality construction and performance.
The connection to the BGA-Top-X features 4x25 sockets for wire wrap pins, providing a reliable and secure connection for programming and interfacing with the Atmel I2C Serial EEPROM AT24Cxxx devices.
The bottom board of the adapter features 2 rows of 2x24 pins arranged in a square pattern, with a pin pitch of 0.6x0.6mm and rows spacing of 600mil. These pins provide the necessary connections for interfacing with the Atmel I2C Serial EEPROM AT24Cxxx devices in the BGA package, enabling data transfer and programming operations.
The order number for this bottom board is 70-0761, and it is specifically designed for use with Atmel I2C Serial EEPROM AT24Cxxx devices in a BGA package arranged in a 4x2 matrix. It is made in Slovakia to high-quality standards, ensuring reliable performance in programming and interfacing applications.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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