The bottom board of the BGA adapter, identified by Ord. no. 70-0324, is specifically designed for Flash devices in a matrix of 8x8 configuration. This bottom board is manufactured in Slovakia and is intended to be used in conjunction with the BGA-Top-X board.
The BGA-Bottom board features a connection to the BGA-Top-X board through 4 rows of sockets for 4x25 wire wrap pins, providing a reliable and secure connection between the top and bottom boards. This allows for efficient programming and testing of BGA devices in the 8x8 matrix configuration.
The bottom board also features 2 rows of 2x24 pins in a square pattern with a pitch of 0.6x0.6mm and a row spacing of 600 mil. This configuration is designed to accommodate the Flash devices in the matrix 8x8 configuration, ensuring proper alignment and connection for programming and testing operations.
With its made-in-Slovakia manufacturing, Ord. no. 70-0324 bottom board is a reliable and high-quality option for BGA programming and testing, specifically tailored for Flash devices in a matrix 8x8 configuration.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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Available |
Self Pickup |
1 Day |
Free |
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inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
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4 - 7 Days |
180 AED / 49 $ |
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2 Weeks |