BGA-Bottom-70

The bottom board of the BGA adapter is designed specifically for CPLD (Complex Programmable Logic Device) devices, specifically Xilinx CoolRunner XPLA3, in a matrix 13x13 configuration. It is manufactured in Slovakia and has an order number of 70-0829. The adapter is designed for connection to the BGA-Top-X with 8x25 3x20 sockets for wire wrap pin, providing a reliable interface for programming and testing operations.



The bottom board of the adapter features 2 rows of 2x24 pins each, arranged in a square pattern with a pin pitch of 0.6x0.6mm and a row spacing of 600mil. This configuration allows for seamless connection to Xilinx CoolRunner XPLA3 CPLD devices, ensuring a reliable and durable interface for programming and testing operations.



The BGA adapter's bottom board is manufactured in Slovakia, ensuring high-quality construction and performance. It is designed to provide a reliable interface for programming and testing Xilinx CoolRunner XPLA3 CPLD devices in a matrix 13x13 configuration. Its durable construction and compatibility with wire wrap pin sockets on the top board make it a valuable tool for electronic engineers and technicians working with Xilinx CPLD devices, enabling efficient and hassle-free programming and testing operations.