The bottom board of this BGA adapter is designed for use with Flash devices arranged in a matrix of 8x6. It is manufactured in Slovakia and has an order number of 70-0292. The connection to the BGA-Top-X is through 4 rows of sockets that accommodate 4x 25 wire wrap pins, ensuring secure and reliable connections. The bottom of the adapter features 2 rows of 2x 24 pins each, arranged in a square pattern with a pin pitch of 0.6x0.6mm and a row spacing of 600mil. This bottom board is designed to provide a reliable interface for programming and testing Flash devices in a production or development environment, making it a versatile and dependable tool for electronic engineers and technicians.
Brand Product | Elnec |
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GTIN | 1, |
Is Featured | No |
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Stock |
Shipping Method |
ETA |
Cost |
|
Available |
Self Pickup |
1 Day |
Free |
|
Available |
inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
|
Available |
International |
4 - 7 Days |
180 AED / 49 $ |
|
pre-order |
General |
2 Weeks |