The bottom board of the BGA adapter with Ord. no. 70-0364 is designed for Flash devices in a matrix configuration of 11x6. This BGA adapter is made in Slovakia and is specifically designed for professional use in programming and testing Flash devices.
The BGA adapter features a connection to BGA-Top-X with 4 rows of sockets for 4x 25 wire wrap pins, allowing for reliable and precise connections between the adapter and the BGA devices. The bottom board of the adapter has 2 rows of 2x 24 pins each, arranged in a square pattern with a pitch of 0.6x0.6mm and rows spacing of 600mil, ensuring accurate and reliable connections during programming and testing operations.
This BGA adapter is made using high-quality materials and manufacturing processes in Slovakia, ensuring its durability and performance in professional settings. It is specifically designed for Flash devices in a matrix configuration of 11x6, making it a reliable and efficient solution for programming and testing these devices. The Ord. no. 70-0364 is a unique identifier for this particular BGA adapter, allowing for easy identification and tracking in a professional environment.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
Write Your Own Review
|
Stock |
Shipping Method |
ETA |
Cost |
|
|
Available |
Self Pickup |
1 Day |
Free |
|
|
Available |
inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
|
|
Available |
International |
4 - 7 Days |
180 AED / 49 $ |
|
|
pre-order |
General |
2 Weeks |