The bottom board of the BGA adapter with Ord. no. 70-0573 is specifically designed for use with Intel RD/LF38/48FxxxxW/L microcontrollers in a matrix of 10x8 BGA package. This bottom board is manufactured in Slovakia, adhering to high-quality standards to ensure reliable performance.
The bottom board features 4 rows of sockets for 4x25 wire wrap pins, allowing for a secure and efficient connection to the BGA-Top-X board. The pins are spaced at a pitch of 600mil, providing a reliable connection for programming or testing purposes.
The bottom board also has 2 rows of 2x24 pins in a square pattern, with a pin pitch of 0.6x0.6mm. This layout is designed to provide a reliable and efficient connection to the Intel RD/LF38/48FxxxxW/L microcontrollers in the BGA package. The bottom board is designed to ensure accurate programming or testing results.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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Stock |
Shipping Method |
ETA |
Cost |
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Available |
Self Pickup |
1 Day |
Free |
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Available |
inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
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Available |
International |
4 - 7 Days |
180 AED / 49 $ |
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pre-order |
General |
2 Weeks |