The bottom board of the BGA adapters is specifically designed for Flash devices arranged in a matrix of 8x6. It is made in Slovakia and identified by Ord. no. 70-0289.
The bottom board features a connection to the BGA-Top-X (top part of the BGA adapter) through 4 rows of sockets for 4x25 wire wrap pins each. These sockets provide a reliable and secure connection between the top and bottom boards, ensuring efficient programming and testing of Flash devices.
The bottom board has 2 rows of 2x24 pins each, arranged in a square pattern with a pitch of 0.6x0.6mm (600 mil). These pins are designed to interface with the Flash devices in the 8x6 matrix configuration, allowing for easy and efficient programming and testing operations.
The bottom board of the BGA adapter is made in Slovakia and is identified by Ord. no. 70-0289. It is specifically designed for Flash devices in a matrix of 8x6 and provides a reliable and efficient solution for programming and testing Flash devices in BGA packages.
In summary, the bottom board of the BGA adapters is designed for Flash devices in a matrix of 8x6, made in Slovakia with Ord. no. 70-0289 identification. It features a connection to the BGA-Top-X through 4 rows of sockets for 4x25 wire wrap pins, and has 2 rows of 2x24 pins for interfacing with the Flash devices.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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