BGA-Bottom-30

The bottom board of the BGA adapter with Ord. no. 70-0439 is specifically designed for use with Flash devices in a 10x8 matrix configuration. The adapter is made in Slovakia and is constructed to high-quality standards to ensure reliable performance.



The bottom board of the adapter features 2 rows of 2x 24 pins each, arranged in a square pattern with a pin spacing of 0.6x0.6mm and rows spacing of 600mil. These pins are designed to provide a reliable electrical connection to the corresponding pins on the Flash devices in the 10x8 matrix configuration.



The adapter also has a connection to BGA-Top-X, which consists of 4 rows of sockets for 4x 25 wire wrap pins. These sockets are designed to provide a reliable connection between the BGA-Top-X and the Flash devices in the 10x8 matrix configuration, enabling efficient programming or testing operations.



The Ord. no. 70-0439 serves as a unique identifier for this specific adapter, making it easy to identify and track in a professional environment. It is important to verify the compatibility of the adapter with the specific Flash device model and matrix configuration before proceeding with programming or testing operations to ensure proper functionality and avoid potential damage to the Flash device or the adapter.