The bottom board of BGA adapters with Ord. no. 70-0435 is designed for use with Flash devices arranged in a 10x8 matrix. It is made in Slovakia, adhering to high-quality manufacturing standards and using premium materials.
The bottom board features 2 rows of 2x 24 pins each, arranged in a square pattern with a pin spacing of 0.6x0.6mm and rows spacing of 600mil. These pins are designed to provide a reliable electrical connection to the corresponding pins on the Flash devices in the 10x8 matrix.
The connection to the BGA-Top-X is designed with 4 rows of sockets for 4x 25 wire wrap pins, providing a secure and stable connection between the top and bottom boards of the BGA adapter. This allows for reliable data transfer and programming or testing operations.
The Ord. no. 70-0435 serves as a unique identifier for this specific bottom board of BGA adapters, making it easy to identify and track in a professional environment. It is important to verify the compatibility of the Flash devices and the BGA-Top-X connection before proceeding with programming or testing operations to ensure proper functionality and avoid potential damage to the devices or the adapter.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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