bottom board of BGA adapters, assigned for Samsung K9F5608/16, MICRON MT29F2G16ABDHC-ET devices in matrix 8x6
made in Slovakia
Ord. no. 70-2362
Connection to BGA-Top-X 4x25 sockets for wire wrap pin
Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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