BGA-Bottom-25

The bottom board of the BGA adapter with Ord. no. 70-0425 is specifically designed for use with Flash devices in a matrix configuration of 10x8 pins. This bottom board is intended to be used in conjunction with a BGA-Top-X board, which provides connections to the top side of the BGA package using 4 rows of sockets for 4x 25 wire wrap pins.



The bottom board of the BGA adapter features 2 rows of 2x 24 pins each, arranged in a square pattern with a pin spacing of 0.6x0.6mm, and rows spacing of 600mil. These pins are designed to connect with the corresponding pins on the Flash device in the BGA package, providing a reliable electrical connection for programming or testing operations.



The BGA adapter is made in Slovakia, ensuring high-quality manufacturing processes and materials. The Ord. no. 70-0425 serves as a unique identifier for this specific bottom board, making it easy to identify and track in a professional environment. It is important to verify the compatibility of the Flash device in the matrix 10x8 BGA configuration with the BGA-Top-X board and the overall BGA adapter design before proceeding with programming or testing operations.