BGA-Bottom-22

The bottom board of the BGA adapter with Ord. no. 70-0400 is designed specifically for use with Xilinx Platform Flash PROM devices in a matrix configuration of 8x6. This adapter is made in Slovakia, ensuring high-quality manufacturing processes and materials.



The bottom board features 2 rows of 2x 24 pins each, arranged in a square pattern with a pin spacing of 0.6x0.6mm and a rows spacing of 600mil. These pins are designed to provide reliable connections with Xilinx Platform Flash PROM devices, allowing for efficient programming, testing, or other operations.



The adapter also includes 4 rows of sockets for 4x 25 wire wrap pins, which provide a connection to the top side of the BGA package. This allows for easy and secure attachment of the adapter to the Xilinx Platform Flash PROM device for programming or other operations.



The Ord. no. 70-0400 serves as a unique identifier for this specific BGA adapter, making it easy to identify and track in a professional environment. Please note that this bottom board is specifically designed for use with Xilinx Platform Flash PROM devices in a matrix configuration of 8x6, and it is important to verify the compatibility of the adapter with the specific device you intend to use before proceeding with programming or testing operations.