BGA-Bottom-21

The bottom board of BGA adapter with Ord. no. 70-0395 is designed for Flash devices in a matrix 8x8 configuration. It is made in Slovakia, ensuring high-quality manufacturing processes and materials.



The adapter features a connection to BGA-Top-X with 4 rows of sockets for 4x 25 wire wrap pins, providing a reliable and secure connection between the BGA device and the adapter. The bottom board of the adapter has 2 rows of 2x 24 pins each, arranged in a square pattern with a pin spacing of 0.6x0.6mm and a rows spacing of 600mil.



This bottom board is designed to accommodate Flash devices in a matrix 8x8 configuration, which typically have a grid of 64 pins on the bottom side of the BGA package. The adapter provides a reliable interconnect solution between the BGA device and external circuitry for programming, testing, or other purposes.



The Ord. no. 70-0395 serves as a unique identifier for this specific bottom board of BGA adapter, making it easy to identify and track in a professional environment. Please note that this bottom board is designed specifically for use with Flash devices in a matrix 8x8 configuration, and may not be suitable for other devices or package configurations. It is important to verify the compatibility of the bottom board with the specific Flash device you intend to use before proceeding with programming or testing operations.