The bottom board of the BGA adapters with Ord. no. 70-1091 is designed for use with Intel PF38F5060M0Y3DF and PF38F5060M0Y3DF devices. These adapters are made in Slovakia and are designed to provide reliable performance for programming or testing of these Intel devices.
The bottom board of the adapter features a 2x24 square pin configuration with a size of 0.6x0.6mm and a row spacing of 600mil. This pin configuration is designed to provide accurate alignment and electrical connectivity with the pins of the Intel PF38F5060M0Y3DF and PF38F5060M0Y3DF devices.
The connection to the BGA-Top-X is through 4x25 sockets for wire wrap pin, which allows for secure and reliable connection during programming or testing processes.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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