BGA-Bottom-180

The bottom board of the BGA adapter with Ord. no. 70-1076 is designed for use with Freescale Coldfire MCF521x, MCF521xx, MCF5221x, and MCF5222x series devices in BGA package with a 9x9 matrix. This adapter is manufactured in Slovakia and is built to meet high-quality standards for durability and reliable performance.



The adapter is designed to connect to the BGA-Top-X with 8x25 3x20 sockets for wire wrap pins, providing a reliable and secure connection to the target Freescale Coldfire devices. The wire wrap pins allow for easy and convenient testing, programming, and development of the target devices.



The bottom board of the adapter features 2x24 square pins with a size of 0.6x0.6mm and a row spacing of 600mil. These pins are designed to provide accurate alignment and electrical connectivity with the target Freescale Coldfire devices in the BGA package with a 9x9 matrix.The special adapter with Ord. no. 70-1077 is designed for use with NXP/Philips LPC24xx family devices in LQFP208 package. This adapter is manufactured in Slovakia and is built to meet high-quality standards for durability and reliable performance.



The adapter features a ZIF (Zero Insertion Force) socket with an operating (mechanical) warranty of 10,000 actuations, providing a reliable and secure connection to the target LPC24xx devices. The ZIF socket allows for easy and convenient testing, programming, and development of the target devices without risking damage to the devices or the adapter.



The socket type of this adapter is ZIF QFP208 with an OpenTop design, allowing for easy placement and removal of the target devices. The bottom board of the adapter features 2x24 square pins with a size of 0.6x0.6mm and a row spacing of 600mil, providing accurate alignment and electrical connectivity with the target LPC24xx devices in LQFP208 package.