The bottom board of the BGA adapter with Ord. no. 70-1035 is specifically designed for ST M39P0R9070E0 devices in a matrix 12x9 configuration. It is made in Slovakia and is compatible with the BGA-Top-X board using 8x25 3x20 sockets for wire wrap pin connections.
The bottom board features a 2x24 pin configuration, with square pins measuring 0.6x0.6mm in size and a row spacing of 600 mil. This configuration is designed to provide a reliable and secure connection to the corresponding ST M39P0R9070E0 devices in a 12x9 matrix.
Please note that it's important to refer to the manufacturer's documentation or contact the manufacturer directly for specific details on the compatibility of the adapter with the intended ST M39P0R9070E0 devices, including pinout, pin spacing, and electrical compatibility. This will ensure that you have accurate and up-to-date information for your specific needs and to ensure proper usage of the adapter with the intended devices.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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