The bottom board of the BGA adapter with Ord. no. 70-1045 is designed for use with Intel PF38(48)FxxxxM0Y0B devices in a matrix of 12x9 BGA package. The bottom board is made in Slovakia, ensuring quality manufacturing standards.
The connection to the BGA-Top-X is designed with 8x25 sockets for wire wrap pins, along with 3x20 sockets for additional wire wrap pins, providing proper connectivity between the adapter and the BGA package.
The bottom board also features 2x24 square pins with a size of 0.6x0.6mm and a row spacing of 600mil. These pins are designed to provide proper alignment and electrical connectivity between the adapter and the devices being tested or programmed.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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ETA |
Cost |
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Available |
Self Pickup |
1 Day |
Free |
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Available |
inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
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Available |
International |
4 - 7 Days |
180 AED / 49 $ |
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pre-order |
General |
2 Weeks |