The bottom board of BGA adapters with Ord. no. 70-1009 is specifically assigned for eMMC (embedded Multi-Media Card) devices in a matrix of 14x14-8x8 6x6-4x4, such as H26M11002AAR, THGBM1G5D2EBAI7, KMAFN0000M-S998000, SDIN5D2-2G, and others. It is made in Slovakia and features a connection to BGA-Top-X with 4x25 sockets for wire wrap pins. The bottom of the adapter has 2x24 pins in a square shape with dimensions of 0.6x0.6mm and rows spacing of 600mil. This bottom board is designed to be used in conjunction with the corresponding top board for eMMC devices, allowing for reliable and efficient interfacing with these devices in BGA packages.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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Self Pickup |
1 Day |
Free |
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inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
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4 - 7 Days |
180 AED / 49 $ |
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pre-order |
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2 Weeks |