BGA-Bottom-16

The bottom board of the BGA adapter with Ord. no. 70-0386 is specifically designed for use with Flash devices in a matrix configuration of 10x8 pins. It is made in Slovakia, ensuring high-quality manufacturing processes and materials.



The bottom board features 2 rows of 2x24 pins each, arranged in a square pattern with a pitch of 0.6x0.6mm and rows spacing of 600mil. These pins are designed to connect to the corresponding pins on the bottom side of the BGA package, providing a secure and reliable connection for programming or testing operations.



The connection to the BGA top-side is facilitated by 4 rows of sockets, each capable of accommodating 4x25 wire wrap pins. These sockets are designed to securely hold the wire wrap pins in place, ensuring reliable and consistent connections between the BGA top-side and the bottom board.



The Ord. no. 70-0386 serves as a unique identifier for this specific bottom board, making it easy to identify and track in a professional environment. Please note that this bottom board is designed specifically for use with Flash devices in a matrix configuration of 10x8 pins, and may not be suitable for other devices or pin configurations. It is important to verify the compatibility of the adapter with the specific Flash device you intend to use before proceeding with programming or testing operations.