The bottom board of BGA adapters with Ord. no. 70-1008 is specifically assigned for Samsung K9F5608/16 and MICRON MT29F2G16ABDHC-ET devices in a matrix of 8x6. It is made in Slovakia and features a connection to BGA-Top-X with 4x25 sockets for wire wrap pins. The bottom of the adapter has 2x24 pins in a square shape with dimensions of 0.6x0.6mm and rows spacing of 600mil. This bottom board is designed to be used in conjunction with the corresponding top board for Samsung K9F5608/16 and MICRON MT29F2G16ABDHC-ET devices, allowing for reliable and efficient interfacing with these devices in BGA packages.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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Stock |
Shipping Method |
ETA |
Cost |
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Available |
Self Pickup |
1 Day |
Free |
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Available |
inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
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Available |
International |
4 - 7 Days |
180 AED / 49 $ |
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pre-order |
General |
2 Weeks |