BGA-Bottom-131

The bottom board of the BGA adapter is specifically designed for Samsung MCP (Multi-Chip Package) devices, which typically include NAND flash memory and RAM integrated into a single package. The bottom board is configured to accommodate MCP devices in a matrix 22x22 arrangement, providing a reliable solution for programming and testing Samsung MCP devices.



The bottom board is made in Slovakia, known for its high-quality manufacturing standards, and has an order number of 70-0975 for easy identification and ordering. It features a connection to BGA-Top-X with an 8x25 3x20 socket configuration for wire wrap pin connection, ensuring a secure and reliable connection between the top and bottom boards of the BGA adapter.



The bottom board also includes a 2x24 pin configuration with square pins measuring 0.6x0.6mm, with rows spaced at 600 mil, providing a precise and reliable connection to the MCP device. This configuration is designed to accommodate Samsung MCP devices and ensure proper alignment and connection during programming and testing processes.



With its high-quality manufacturing and specific design for Samsung MCP devices, the bottom board of the BGA adapter with the ord. no. 70-0975 is a dependable solution for programming and testing MCP devices. Made in Slovakia, it offers assurance of its quality and performance for reliable operation in professional settings.