BGA-Bottom-11

The bottom board of the BGA adapter, assigned for Flash devices in a matrix 8x8 configuration, is a reliable and high-quality solution for programming and testing BGA packages. It is made in Slovakia using top-notch materials and manufacturing processes to ensure its durability and performance.



With Ord. no. 70-0347, this bottom board features 4 rows of sockets for 4x 25 wire wrap pins, providing a secure and reliable connection to the BGA-Top-X board. The bottom of the adapter has 2 rows of 2x 24 pins, with a square shape and a pitch of 0.6x0.6mm. The rows spacing is 600mil, allowing for easy and precise connections to the Flash devices in the 8x8 matrix configuration.



This bottom board of the BGA adapter is specifically designed for Flash devices in a matrix 8x8 configuration, providing a perfect fit and compatibility for efficient programming and testing operations. Its high-quality construction and reliable performance make it ideal for professional use in various applications.



With Ord. no. 70-0347, this bottom board of the BGA adapter is a reliable and durable solution for programming and testing Flash devices in a matrix 8x8 configuration. Its high-quality manufacturing and materials, made in Slovakia, ensure its longevity and performance, making it a suitable choice for demanding programming and testing operations.