The bottom board of this BGA adapter is designed specifically for ST STM32F101xx and STM32F103xx devices in a matrix of 10x10 pins. It is manufactured in Slovakia to ensure high quality and reliability. The order number for this bottom board of BGA adapter is 70-0867.
The connection to the BGA-Top-X is made through 8x25 sockets, as well as 3x20 sockets for wire wrap pins, providing a reliable connection between the top and bottom boards during programming and testing operations.
The bottom board features a 2x24 pin configuration, arranged in a square pattern with a pitch of 0.6x0.6mm, and rows spacing of 600mil. This configuration allows for a secure and reliable connection to the STM32F101xx and STM32F103xx devices in the BGA package.
Overall, this bottom board of the BGA adapter is designed to provide a reliable and efficient solution for programming and testing ST STM32F101xx and STM32F103xx devices in a matrix of 10x10 pins, and it is manufactured to high quality standards in Slovakia.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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Stock |
Shipping Method |
ETA |
Cost |
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Available |
Self Pickup |
1 Day |
Free |
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Available |
inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
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Available |
International |
4 - 7 Days |
180 AED / 49 $ |
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pre-order |
General |
2 Weeks |