BGA-Bottom-103

The bottom board of BGA adapters with Ord. no. 70-1080 is specifically designed for FPGA devices Actel Fusion in a 16x16 matrix package. The bottom board is made in Slovakia, meeting high-quality standards for reliable performance.



The connection to the BGA-Top-X on this bottom board consists of 8x25 square sockets and 3x20 square sockets for wire wrap pins, totaling 488 sockets, providing accurate alignment and electrical connectivity with the corresponding top board. The bottom board also features a 2x24 square pin configuration with a size of 0.6x0.6mm and a row spacing of 600mil. This configuration allows for proper connection and communication with the Actel Fusion FPGA devices.



It's important to follow the manufacturer's instructions and guidelines for proper usage, handling, and connectivity with the Actel Fusion FPGA devices to ensure optimal performance and compatibility.