The bottom board of the BGA adapter, identified by Ord. no. 70-0337, is specifically designed for Flash devices in a 10x8 matrix configuration. The bottom board is made in Slovakia using high-quality materials and manufacturing processes to ensure its reliability and durability for mass-production applications.
The connection to the BGA-Top-X board is established through 4 rows of sockets for 4x 25 wire wrap pins, providing a reliable and secure connection between the top and bottom boards. This allows for efficient programming and testing of BGA packages.
The bottom board features 2 rows of 2x24 pins in a square pattern, with a pitch of 0.6x0.6mm and rows spacing of 600mil. This configuration is compatible with Flash devices in a 10x8 matrix arrangement, allowing for easy and precise connections for programming and testing operations.
The BGA adapter bottom board, with Ord. no. 70-0337, is a reliable and durable solution for programming and testing Flash devices in a 10x8 matrix configuration, and is suitable for mass-production purposes.
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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Stock |
Shipping Method |
ETA |
Cost |
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Available |
Self Pickup |
1 Day |
Free |
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Available |
inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
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Available |
International |
4 - 7 Days |
180 AED / 49 $ |
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pre-order |
General |
2 Weeks |