Specifications:
bottom board of BGA adapter, assigned for TI (TMS) MSP430F52xx devices in matrix 9x9
supported from PG4UW software version 3.25a
made in Slovakia
Ord. no. 70-3906
Connection to BGA-Top-X 8x25 3x20 sockets for wire wrap pin
Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
| Brand Product | Elnec |
|---|---|
| GTIN | 1, |
| Is Featured | No |
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Stock |
Shipping Method |
ETA |
Cost |
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Available |
Self Pickup |
1 Day |
Free |
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Available |
inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
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Available |
International |
4 - 7 Days |
180 AED / 49 $ |
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pre-order |
General |
2 Weeks |